![]() ![]() Thin wafer handling process is done by attaching to a metallic wafer frame, which provides mechanical support during wafer dicing and backside processing. Grinding is another process that reduces wafer thickness to meet the demands of many sectors such as electronics, automotive, and communication devices, among others. Because of the increasing need for smaller wafers and tougher die, dicing technologies are continually changing, having a substantial influence on the dicing equipment sector. Dicing equipment is an instrument used in this operation. The thin wafer dicing equipment market may be divided into four categories based on dicing technology:Ī wafer is a thin slice of semiconductor material, and dicing is the process of cutting semiconductors, glass crystals, and a variety of other materials. In this article, we compare the differences between Saw Dicing, Laser Dicing, Plasma Dicing, and Scribing Dicing. ![]()
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